This temperature is commonly higher than the temperature of the device s exterior and its case.
Calculation of surface area of heatsink.
H air film convective coefficient a exposed surface area of the fins.
E lateral edge length.
Total sa a 2 2a a 2 2 h2.
This calculator should not be used in instances where the heat source is much smaller than the base of the heat sink.
The metal surface is supposed to be untreated shiny metal colour and the thickness should exceed 1 5 mm.
Heat sink sizing calculator rough estimate.
Krug december 2015.
Check out the heatsinkcalculator if you need to evaluate these smaller heat sources.
Given height h and edge length a the surface area can be calculated using the following equations.
P perimeter of the fins.
It is assumed that all surfaces of the heat sink are gray and.
Heat transfer by convection of a heat sink with fins calculator and equations.
S slant height.
S tot total surface area.
Heat sink sizing calculator v4.
Next the radiation heat transfer from the area a 2 given by equation 10 is calculated.
Is the convection coefficient of the heat sink is the total surface area of the heat sink is the temperature of the source being cooled is the ambient temperature.
Any heat sink with a larger value of h x a will be able to produce a lower source temperature.
The variables ε is the surface emissivity of the heat sink.
The stefan boltzmann constant σ has a value of 5 67 10 8 w m 2 k 4.
Please use our online heat sink calculator for this step.
Concentration of the heat source over an area much smaller than heat sink base is not taken into account in this calculator.
Lateral sa 2a a 2 2 h2.
Heat sink design and optimization i.
Fins are used to increase heat transfer area and provide a cooling effect.
However if h a p k is greater than 1 00 the fins will insulate and prevent heat flow.
The surface area of a square pyramid is comprised of the area of its square base and the area of each of its four triangular faces.
2 u channel interior surface identification 4.
The highest operating temperature that a semiconductor in an electronic device can withstand is called its junction temperature.
Where a hs is the surface of the metal plate in cm 2 and r th hs a is the thermal resistance from the heat sink to the ambient in c w.
The p rocedure for calculating the radiative heat transfer coefficient for the u channels is outlined in the book by ellison ref.
Base sa a 2.
Estimate the overall volume of the heat sink required to cool a heat source by using the following equation.
Typical values are listed in the article the importance of radiation in heat sink design.
Plate fin heat sink attached to a printed circuit board continue.
A side length.
